DocumentCode
3304690
Title
Thermal impedance measurement of a self-heating probe
Author
Horn, Michael
Author_Institution
Inst. for Meas. & Autom., Bundeswehr Univ., Munich
fYear
2005
fDate
Oct. 30 2005-Nov. 3 2005
Abstract
In case of large temperature dependencies of the properties, due to sufficient high voltages and currents the power dissipation in electric devices causes ´virtual´ electrical impedances. The reason is the thermal impedance, which is determined by the inside structure and the environmental conditions. For many fields in solid-state circuit design and sensor applications, the actual value of the thermal impedance bears important information about the state of the device and its surroundings. In the paper it is shown, how the actual value of the thermal impedance can be determined directly from the continuously measured virtual electrical impedance
Keywords
electric impedance measurement; network synthesis; probes; thermal analysis; self-heating probe; sensor applications; solid-state circuit design; thermal impedance measurement; Circuits; Current measurement; Electric resistance; Electric variables measurement; Frequency; Impedance measurement; Power measurement; Probes; Temperature sensors; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Sensors, 2005 IEEE
Conference_Location
Irvine, CA
Print_ISBN
0-7803-9056-3
Type
conf
DOI
10.1109/ICSENS.2005.1597846
Filename
1597846
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