• DocumentCode
    3304690
  • Title

    Thermal impedance measurement of a self-heating probe

  • Author

    Horn, Michael

  • Author_Institution
    Inst. for Meas. & Autom., Bundeswehr Univ., Munich
  • fYear
    2005
  • fDate
    Oct. 30 2005-Nov. 3 2005
  • Abstract
    In case of large temperature dependencies of the properties, due to sufficient high voltages and currents the power dissipation in electric devices causes ´virtual´ electrical impedances. The reason is the thermal impedance, which is determined by the inside structure and the environmental conditions. For many fields in solid-state circuit design and sensor applications, the actual value of the thermal impedance bears important information about the state of the device and its surroundings. In the paper it is shown, how the actual value of the thermal impedance can be determined directly from the continuously measured virtual electrical impedance
  • Keywords
    electric impedance measurement; network synthesis; probes; thermal analysis; self-heating probe; sensor applications; solid-state circuit design; thermal impedance measurement; Circuits; Current measurement; Electric resistance; Electric variables measurement; Frequency; Impedance measurement; Power measurement; Probes; Temperature sensors; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Sensors, 2005 IEEE
  • Conference_Location
    Irvine, CA
  • Print_ISBN
    0-7803-9056-3
  • Type

    conf

  • DOI
    10.1109/ICSENS.2005.1597846
  • Filename
    1597846