DocumentCode :
3304814
Title :
Design of compact RF components for low-cost high-performance wireless front-ends
Author :
Zheng, G. ; Pinel, S. ; Lim, K. ; Li, R. ; Tentzeris, M. ; Papapolymerou, J. ; Laskar, J. ; Lenoir, B. ; Blondy, P. ; Baillargeat, D. ; Guillon, P.
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
fYear :
2002
fDate :
17-19 Aug. 2002
Firstpage :
259
Lastpage :
262
Abstract :
This paper presents the design and fabrication of RF components for compact and low cost wireless radio front-end systems. The system-on-package (SOP) concept has been applied to the design of an integrated C-Band transceiver and results are presented for a high performance LTCC band-pass filter and a via-fed stacked cavity-backed patch antenna. Multi-layer organic packaging development is also reported for very high Q-factor inductors and embedded filters. In addition, simulations and experimental data for an RF-MEMS ´2bit × 2bit´ tuner and a micromachined filter demonstrate the benefits of the integration of micromachined structures.
Keywords :
micromechanical devices; packaging; transceivers; LTCC bandpass filter; RF component; RF-MEMS tuner; embedded filter; high-Q inductor; integrated C-band transceiver; micromachined filter; multi-layer organic packaging; system-on-package; via-fed stacked cavity-backed patch antenna; wireless radio front-end system; Band pass filters; Costs; Fabrication; Inductors; Packaging; Patch antennas; Q factor; Radio frequency; Radiofrequency microelectromechanical systems; Transceivers;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave and Millimeter Wave Technology, 2002. Proceedings. ICMMT 2002. 2002 3rd International Conference on
Print_ISBN :
0-7803-7486-X
Type :
conf
DOI :
10.1109/ICMMT.2002.1187685
Filename :
1187685
Link To Document :
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