• DocumentCode
    3304834
  • Title

    Design for 3D Integration and Applications

  • Author

    Franzon, Paul D. ; Davis, William Rhett ; Steer, Michael B. ; Hao, Hua ; Lipa, Steven ; Luniya, Sonali ; Mineo, Christopher ; Oh, Julie ; Sule, Ambirish ; Thorolfsson, Thor

  • Author_Institution
    North Carolina State Univ., Raleigh
  • fYear
    2007
  • fDate
    July 30 2007-Aug. 2 2007
  • Firstpage
    263
  • Lastpage
    266
  • Abstract
    3D stacking and integration can provide system advantages equivalent to up to two technology nodes of scaling. This paper explores application drivers and computer aided design (CAD) for 3D ICs.
  • Keywords
    circuit CAD; integrated circuit design; 3D integration circuits; 3D stacking; CAD; computer aided design; Application software; CMOS process; Computer applications; Costs; Design automation; Integrated circuit interconnections; Packaging; Paper technology; Stacking; Wire; 3D IC; CAD; VLSI;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Signals, Systems and Electronics, 2007. ISSSE '07. International Symposium on
  • Conference_Location
    Montreal, Que.
  • Print_ISBN
    1-4244-1448-2
  • Electronic_ISBN
    1-4244-1449-0
  • Type

    conf

  • DOI
    10.1109/ISSSE.2007.4294463
  • Filename
    4294463
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3304834