Title :
3D Multilayer Integration and Packaging on Organic/Paper Low-cost Substrates for RF and Wireless Applications
Author :
Yang, Li ; Tentzeris, Manos M.
Author_Institution :
Georgia Inst. of Technol., Atlanta
fDate :
July 30 2007-Aug. 2 2007
Abstract :
In this paper, solutions for developing low-cost 3D multilayer integration and packaging on the organic substrate liquid crystal polymer (LCP) and the paper substrate have been presented. The key components in RF wireless applications, namely dual band filters, dual-frequency/dual-polarization microstrip antenna arrays and an RFID tag have been designed and fabricated. Test results of the structures show good agreement between the simulation and measurement over their respective bandwidths, demonstrating stable performance of the organic/paper substrates.
Keywords :
liquid crystal polymers; microstrip antenna arrays; multilayers; packaging; paper; radiofrequency filters; radiofrequency identification; radiofrequency integrated circuits; substrates; RFID tag; dual band filters; dual-frequency antenna arrays; dual-polarization antenna arrays; liquid crystal polymer; low-cost substrates; microstrip antenna arrays; multilayer integration; organic substrates; packaging; paper substrates; radiofrequency applications; wireless applications; Antenna accessories; Dual band; Liquid crystal polymers; Microstrip antenna arrays; Microstrip antennas; Microstrip components; Microstrip filters; Nonhomogeneous media; Packaging; Radio frequency; Dual-band antenna; RF and mm-waves front-end module; RFID; dual-band filter; inkjet-printing; liquid crystal polymer (LCP); multilayer modules; system-on-package (SOP); three-dimensional (3D) integration;
Conference_Titel :
Signals, Systems and Electronics, 2007. ISSSE '07. International Symposium on
Conference_Location :
Montreal, Que.
Print_ISBN :
1-4244-1448-2
Electronic_ISBN :
1-4244-1449-0
DOI :
10.1109/ISSSE.2007.4294464
