DocumentCode
3305247
Title
Plasma spray forming as a novel production method for thermoelectric materials
Author
Schilz, Jürgen ; Riffel, Michael ; Mathesius, Robert ; Schiller, Günter ; Henne, Rudolf ; Smith, Ronald W.
Author_Institution
Inst. fur Werkstoff-Forschung, Deutsche Forschungsanstalt fur Luft- und Raumfahrt, Koln, Germany
fYear
1996
fDate
26-29 March 1996
Firstpage
71
Lastpage
74
Abstract
To date the development of thermoelectric materials and technology has reached a level, that allows the fabrication of reliable generators. It now turns out that the main impediment on the way to large scale, commercial (terrestrial) applications is primarily not the comparable low efficiency of the devices, but the high investment costs, which are still on the order of several ten Dollars per Watt. Necessary conditions for cost reduction are the availability of (i) cheap, non-toxic materials in large quantities and (ii) processing methods which allow efficient production; preferably the formation of complete device structures within a single, automized manufacturing step. This paper introduces plasma spraying as a forming process with the potential to fulfil the above stated condition. The paper reports on first studies on the consolidation and characterization of iron disilicide (FeSi/sub 2/). It was found that plasma spray forming is applicable to produce dense materials with properties comparable to hot-pressed ones.
Keywords
iron compounds; plasma arc spraying; plasma deposited coatings; semiconductor growth; semiconductor materials; semiconductor thin films; thermoelectric power; FeSi/sub 2/; cost reduction; plasma spray forming; thermoelectric materials; Costs; Fabrication; Impedance; Materials reliability; Plasma applications; Plasma materials processing; Plasma properties; Production; Thermal spraying; Thermoelectricity;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermoelectrics, 1996., Fifteenth International Conference on
Conference_Location
Pasadena, CA, USA
Print_ISBN
0-7803-3221-0
Type
conf
DOI
10.1109/ICT.1996.553259
Filename
553259
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