DocumentCode
3305259
Title
Alternate metal virtual ground EPROM array implemented in a 0.8 mu m process for very high density applications
Author
Kazerounian, R. ; Bergemont, A. ; Roy, A. ; Wolstenholme, G. ; Irani, R. ; Shamay, M. ; Gaffur, H. ; Rezvani, G.A. ; Anderson, L. ; Haggag, H. ; Shacham, E. ; Kauk, P. ; Nielson, P. ; Kablanian, A. ; Chhor, K. ; Perry, J. ; Sethi, R. ; Eitan, B.
Author_Institution
WSI, Fremont, CA, USA
fYear
1991
fDate
8-11 Dec. 1991
Firstpage
311
Lastpage
314
Abstract
The alternate metal virtual ground EPROM array (AMG) is introduced as a new scaling concept. This array dramatically reduces cell size by making poly pitch the only limitation in both X and Y directions. The AMG concept scales cell size by sharing one metal line per two diffusion bit lines and relies on a segmentation scheme and fieldless array to achieve the poly pitch limited cell. The cell size in 0.8- mu m technology is 2.56 mu m/sup 2/, which is considerably smaller than the standard EPROM cell in 0.6- mu m technology. A major advantage of this array is reduction of drain turn-on induced punch-through. This reduction allows scaling of effective channel length to as low as 0.25 mu m, resulting in high read current and fast programming time.<>
Keywords
CMOS integrated circuits; EPROM; VLSI; integrated memory circuits; 0.25 micron; 0.8 micron; CMOS; ULSI; alternate metal virtual ground; cell size; effective channel length; fieldless array; high density applications; poly pitch limited cell; programming time; read current; scaling concept; segmentation scheme; sharing one metal line; EPROM; Process design; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1991. IEDM '91. Technical Digest., International
Conference_Location
Washington, DC, USA
ISSN
0163-1918
Print_ISBN
0-7803-0243-5
Type
conf
DOI
10.1109/IEDM.1991.235441
Filename
235441
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