DocumentCode
3305643
Title
Fabrication and operation of silicon field emission cathode arrays
Author
Spallas, J.P. ; MacDonald, N.C.
Author_Institution
Cornell Univ., Ithaca, NY, USA
fYear
1991
fDate
8-11 Dec. 1991
Firstpage
209
Lastpage
212
Abstract
The authors report on the operation and fabrication of a novel field emission structure based on an array of silicon-strip microcathodes. Using high-resolution electron-beam lithography, several highly selective anisotropic reactive ion etches, and high-temperature lateral thermal oxidation, strip-type cathodes have been fabricated. The cathode strip diameters range from 20 nm to 30 nm. The self-aligned anode is cantilevered typically less than 500 nm above the cathode. Arrays of 28, 25- mu m-long strips have been tested. The I-V characteristics obey the Fowler-Nordheim theory. Array currents are detected at 4 V and reach a maximum value of 274.3 mu A at 15.5 V. The maximum array current density is 2.0 A/cm/sup 2/. The measured diode conductance is 64.3 mu S.<>
Keywords
cathodes; electron beam lithography; electron field emission; nanotechnology; silicon; sputter etching; vacuum microelectronics; 20 to 30 nm; 25 micron; 274.3 muA; 4 to 15.5 V; 500 nm; 64.3 muS; Fowler-Nordheim theory; I-V characteristics; Si field emission cathodes; anisotropic reactive ion etches; array current density; diode conductance; electron-beam lithography; fabrication; field emission cathode arrays; field emission structure; high-temperature lateral thermal oxidation; operation; self-aligned anode; strip-type cathodes; Anisotropic magnetoresistance; Anodes; Cathodes; Current density; Etching; Fabrication; Lithography; Oxidation; Silicon; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1991. IEDM '91. Technical Digest., International
Conference_Location
Washington, DC, USA
ISSN
0163-1918
Print_ISBN
0-7803-0243-5
Type
conf
DOI
10.1109/IEDM.1991.235465
Filename
235465
Link To Document