DocumentCode :
3305643
Title :
Fabrication and operation of silicon field emission cathode arrays
Author :
Spallas, J.P. ; MacDonald, N.C.
Author_Institution :
Cornell Univ., Ithaca, NY, USA
fYear :
1991
fDate :
8-11 Dec. 1991
Firstpage :
209
Lastpage :
212
Abstract :
The authors report on the operation and fabrication of a novel field emission structure based on an array of silicon-strip microcathodes. Using high-resolution electron-beam lithography, several highly selective anisotropic reactive ion etches, and high-temperature lateral thermal oxidation, strip-type cathodes have been fabricated. The cathode strip diameters range from 20 nm to 30 nm. The self-aligned anode is cantilevered typically less than 500 nm above the cathode. Arrays of 28, 25- mu m-long strips have been tested. The I-V characteristics obey the Fowler-Nordheim theory. Array currents are detected at 4 V and reach a maximum value of 274.3 mu A at 15.5 V. The maximum array current density is 2.0 A/cm/sup 2/. The measured diode conductance is 64.3 mu S.<>
Keywords :
cathodes; electron beam lithography; electron field emission; nanotechnology; silicon; sputter etching; vacuum microelectronics; 20 to 30 nm; 25 micron; 274.3 muA; 4 to 15.5 V; 500 nm; 64.3 muS; Fowler-Nordheim theory; I-V characteristics; Si field emission cathodes; anisotropic reactive ion etches; array current density; diode conductance; electron-beam lithography; fabrication; field emission cathode arrays; field emission structure; high-temperature lateral thermal oxidation; operation; self-aligned anode; strip-type cathodes; Anisotropic magnetoresistance; Anodes; Cathodes; Current density; Etching; Fabrication; Lithography; Oxidation; Silicon; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 1991. IEDM '91. Technical Digest., International
Conference_Location :
Washington, DC, USA
ISSN :
0163-1918
Print_ISBN :
0-7803-0243-5
Type :
conf
DOI :
10.1109/IEDM.1991.235465
Filename :
235465
Link To Document :
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