Title :
Efficient Modeling of Packaging for Silicon-Base Inductor and MIM Capacitor
Author :
Hsu, Chia-Wei ; Wu, Sung-Mao ; Yeh, Wen-Kuan ; Li, Mark
Author_Institution :
Nat. Univ. of Kaohsiung, Kaohsiung
fDate :
July 30 2007-Aug. 2 2007
Abstract :
Summary form only given. Equivalent model before and after packaging of integrate passive components, including spiral inductors and Metal-Insulator-Metal capacitors, are presented in this paper. Methods of conventional pi model as well as electrical parameters extracting by VNA measurement are also shown. The impact of packaging on high frequency performance and quality factor of integrated passive component before and after packaging has been investigated.
Keywords :
MIM devices; Q-factor; capacitors; electronics packaging; elemental semiconductors; inductors; passive networks; silicon; MIM capacitor; Si; VNA measurement; electrical parameters; integrated passive components quality factor; silicon base inductor; spiral inductors; Electric variables measurement; Frequency; Inductors; MIM capacitors; Q factor; Research and development; Semiconductor device packaging; Spirals; Flip-chip; capacitor model; inductor model; quality factor;
Conference_Titel :
Signals, Systems and Electronics, 2007. ISSSE '07. International Symposium on
Conference_Location :
Montreal, Que.
Print_ISBN :
1-4244-1448-2
Electronic_ISBN :
1-4244-1449-0
DOI :
10.1109/ISSSE.2007.4294536
