• DocumentCode
    3306550
  • Title

    Monitoring thickness change of the Dongkemadi Glacier on Qinghai-Tibetan Plateau using SRTM DEM and map-based topographic data

  • Author

    Xing, Qiang ; Li, Zhen ; Zhou, Jianmin

  • Author_Institution
    Key Lab. of Digital Earth, CAS, Beijing, China
  • fYear
    2010
  • fDate
    25-30 July 2010
  • Firstpage
    1769
  • Lastpage
    1771
  • Abstract
    In this paper we measured the long-term thickness change of the Dongkemadi Glacier(DG) on Tanggula Mountain, Qinghai-Tibetan Plateau, using the Shuttle Radar Topography Mission (SRTM) C-band data(2000) and a digital elevation model(DEM) generated from topographic map(1969). First we check the accuracy of SRTM DEM by comparison at 16 random independent points in surrounding non-glacier area below 5500m a.s.l., then we focus on an analysis of the glacier´s surface thickness change features and a validation of the results using GPS survey data (2007) and DEM(1969) in Xiao Dongkemadi Glacier(XDG). The result shows XDG decreased by an average of 6.15m, or 0.20 m a-1 between 1969 and 2000. We estimate the error of annual thickness change rate to be on the order of 5% compared to the result of field measurement while Da Dongkemadi Glacier(DDG) decreased by an average of 20.74m or 0.67m a-1(1969-2000).
  • Keywords
    Global Positioning System; digital elevation models; glaciology; hydrological techniques; remote sensing by radar; topography (Earth); AD 1969 to 2000; C-band data; China; Da Dongkemadi Glacier; Dongkemadi Glacier; GPS survey data; Qinghai-Tibetan Plateau; Shuttle Radar Topography Mission; Tanggula Mountain; Xiao Dongkemadi Glacier; digital elevation model; map-based topographic data; thickness change rate; Accuracy; Earth; Global Positioning System; Monitoring; Remote sensing; Satellites; Thickness measurement; GPS; SRTM; digital elevation model; glacier; thickness change; topographic map;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Geoscience and Remote Sensing Symposium (IGARSS), 2010 IEEE International
  • Conference_Location
    Honolulu, HI
  • ISSN
    2153-6996
  • Print_ISBN
    978-1-4244-9565-8
  • Electronic_ISBN
    2153-6996
  • Type

    conf

  • DOI
    10.1109/IGARSS.2010.5649895
  • Filename
    5649895