DocumentCode :
3306630
Title :
Reliability analysis for computer manufacture process
Author :
Lendvay, M. ; Bencsik, A.L.
Author_Institution :
Inst. of Microelectron. & Technol., Budapest Polytech.
fYear :
2004
fDate :
Aug. 30 2004-Sept. 1 2004
Firstpage :
297
Lastpage :
302
Abstract :
First section of the paper gives an overview about the usually used reliability analysis procedures. The following chapter demonstrates the computer manufacturing technology, to manufacture computer boards used surface mount technology (SMT) and bore-mounted technology. In the chapter 4 is discussed reliability analysis for the manufacture process, stressed the importance of the fault mode and effects analysis method. This method identifies the potential process errors, determines the possible effects, and identifies the possible consequences of the manufacturing and mounting process in order to decrease the occurrence of error conditions
Keywords :
DP industry; fault diagnosis; manufacturing processes; reliability; surface mount technology; bore-mounted technology; computer boards; computer manufacturing technology; effects analysis; fault mode; manufacture process; reliability analysis; surface mount technology; Application software; Computer aided manufacturing; Computer errors; Consumer electronics; Error-free operation; Failure analysis; Maintenance; Manufacturing processes; Microelectronics; Surface-mount technology;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Computational Cybernetics, 2004. ICCC 2004. Second IEEE International Conference on
Conference_Location :
Vienna
Print_ISBN :
0-7803-8588-8
Type :
conf
DOI :
10.1109/ICCCYB.2004.1437733
Filename :
1437733
Link To Document :
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