Fabrication and simulation of copper spiral on-chip inductors for RF wireless communication

Author

He, Johnny H. ; Lihui, Guo ; Xie, Joseph

Author_Institution

Inst. of Microelectron., Singapore, Singapore

fYear

2002

fDate

17-19 Aug. 2002

Firstpage

713

Lastpage

716

Abstract

This paper presents some new results of the simulation and fabrication of high-Q cascade inductor for the RF wireless communication circuits at 2.45 GHz and 5.5 GHz. The cascade inductor is introduced and analyzed in detail with the help of HP-ADS Momentum simulation tool. The Q values of the 3-turn cascade inductor are 16.8 and 8.5. while those of the 6-turn normal inductor are only 8 and 2.8, at 2.45 GHz and 5.5 GHz respectively, and their inductances are similar at 7.5 nH and 10 nH, respectively. The area consumed by the inductor is also reduced for miniaturization of the RF IC with same numbers of mask. A new way to tune the inductance by tuning via thickness is also shown here. The research is based on Momentum simulation and copper damascene interconnection process.

Keywords

MMIC; Q-factor; UHF integrated circuits; circuit simulation; circuit tuning; inductors; integrated circuit interconnections; integrated circuit modelling; 2.45 GHz; 5.5 GHz; Cu; HP-ADS Momentum simulation tool; MMIC; Q values; RF wireless communication; copper damascene interconnection process; high-Q cascade inductor; inductance tuning; mask; spiral on-chip inductors; via thickness; Analytical models; Circuit simulation; Copper; Fabrication; Inductance; Inductors; Radio frequency; Radiofrequency integrated circuits; Spirals; Wireless communication;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave and Millimeter Wave Technology, 2002. Proceedings. ICMMT 2002. 2002 3rd International Conference on

Print_ISBN

0-7803-7486-X

Type

conf

DOI

10.1109/ICMMT.2002.1187800

Filename

1187800