DocumentCode :
3306828
Title :
Fabrication and simulation of copper spiral on-chip inductors for RF wireless communication
Author :
He, Johnny H. ; Lihui, Guo ; Xie, Joseph
Author_Institution :
Inst. of Microelectron., Singapore, Singapore
fYear :
2002
fDate :
17-19 Aug. 2002
Firstpage :
713
Lastpage :
716
Abstract :
This paper presents some new results of the simulation and fabrication of high-Q cascade inductor for the RF wireless communication circuits at 2.45 GHz and 5.5 GHz. The cascade inductor is introduced and analyzed in detail with the help of HP-ADS Momentum simulation tool. The Q values of the 3-turn cascade inductor are 16.8 and 8.5. while those of the 6-turn normal inductor are only 8 and 2.8, at 2.45 GHz and 5.5 GHz respectively, and their inductances are similar at 7.5 nH and 10 nH, respectively. The area consumed by the inductor is also reduced for miniaturization of the RF IC with same numbers of mask. A new way to tune the inductance by tuning via thickness is also shown here. The research is based on Momentum simulation and copper damascene interconnection process.
Keywords :
MMIC; Q-factor; UHF integrated circuits; circuit simulation; circuit tuning; inductors; integrated circuit interconnections; integrated circuit modelling; 2.45 GHz; 5.5 GHz; Cu; HP-ADS Momentum simulation tool; MMIC; Q values; RF wireless communication; copper damascene interconnection process; high-Q cascade inductor; inductance tuning; mask; spiral on-chip inductors; via thickness; Analytical models; Circuit simulation; Copper; Fabrication; Inductance; Inductors; Radio frequency; Radiofrequency integrated circuits; Spirals; Wireless communication;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave and Millimeter Wave Technology, 2002. Proceedings. ICMMT 2002. 2002 3rd International Conference on
Print_ISBN :
0-7803-7486-X
Type :
conf
DOI :
10.1109/ICMMT.2002.1187800
Filename :
1187800
Link To Document :
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