Title :
Very low loss waveguides formed by fluorine induced disordering of GaInAs/GaInAsP quantum wells
Author :
Bradshaw, S.A. ; Marsh, J.H. ; Glew, R.W.
Author_Institution :
Dept. of Electron. & Electr. Eng., Glasgow Univ., UK
Abstract :
Selective area intermixing of quantum well (QW) structures using fluorine as a disordering impurity is demonstrated. Bandgap widened ridge waveguides have been fabricated using this process and the resultant waveguides had losses of between 8.5 dB cm/sup -1/ and 0.6 dB cm/sup -1/. In purely thermally intermixed samples, the lowest loss measured is 18.5 dB cm/sup -1/ and, if an electrically active dopant was used as a disordering species, a propagation loss due to free-carrier absorption of greater than 40 dB cm/sup -1/ is expected. By implanting with fluorine to give a concentration of around 10/sup 18/ cm/sup -3/ and annealing at 700 degrees C it is possible to widen the QW structure by as much as 40 meV, while leaving the unimplanted structure relatively unchanged. It has also been shown that SiO/sub 2/, but not Si/sub 3/N/sub 4/, dielectric caps can be used to provide protection during the annealing stage of the process.<>
Keywords :
III-V semiconductors; annealing; fluorine; gallium arsenide; gallium compounds; impurities; indium compounds; integrated optics; optical losses; optical waveguides; semiconductor quantum wells; 18.5 dB; 40 dB; 700 degC; 8.5 to 0.6 dB; F disordering impurity; GaInAs-GaInAsP; Si/sub 3/N/sub 4/ dielectric cap; SiO/sub 2/ dielectric cap; annealing; bandgap widened ridge waveguides; electrically active dopant; free-carrier absorption; losses; optoelectronic devices; propagation loss; quantum wells; selective area intermixing; Dielectric substrates; Europe; Implants; Impurities; Optical device fabrication; Photonic band gap; Protection; Rapid thermal annealing; Rapid thermal processing; Surface contamination;
Conference_Titel :
Indium Phosphide and Related Materials, 1992., Fourth International Conference on
Conference_Location :
Newport, RI, USA
Print_ISBN :
0-7803-0522-1
DOI :
10.1109/ICIPRM.1992.235614