• DocumentCode
    330787
  • Title

    Operation of power semiconductors at their thermal limit

  • Author

    Rodrigues, R.G. ; Piccone, D.E. ; Tobin, W.H. ; Willinger, L.W. ; Barrow, J.A. ; Hansen, T.A. ; Zhao, J. ; Cao, L.

  • Author_Institution
    Silicon Power Corp., Malvern, PA, USA
  • Volume
    2
  • fYear
    1998
  • fDate
    12-15 Oct. 1998
  • Firstpage
    942
  • Abstract
    Based on experience gained with Si power devices, a review is presented of some of the thermal limitations to the operation of power semiconductor devices, which are encountered in steady state operation, but also, much more stringently, under switching and pulse power transients. Devices based on SiC are expected to be capable of steady-state operation at much higher temperature than Si devices. Here the authors discuss predictable failure mechanisms of SiC devices at the extremely high temperatures reached under surge conditions, and their life expectancy under thermal cycling operation.
  • Keywords
    failure analysis; power semiconductor switches; reviews; semiconductor device models; semiconductor device reliability; silicon compounds; switching transients; thermal analysis; SiC; SiC devices; high-temperature operation; life expectancy; power semiconductor operation; predictable failure mechanisms; pulse power transients; steady state operation; surge conditions; switching transients; thermal cycling operation; thermal limitations; Cooling; Costs; Electrical equipment industry; Insulated gate bipolar transistors; Military aircraft; Power semiconductor switches; Silicon carbide; Temperature; Thermal degradation; Thyristors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industry Applications Conference, 1998. Thirty-Third IAS Annual Meeting. The 1998 IEEE
  • Conference_Location
    St. Louis, MO, USA
  • ISSN
    0197-2618
  • Print_ISBN
    0-7803-4943-1
  • Type

    conf

  • DOI
    10.1109/IAS.1998.730259
  • Filename
    730259