• DocumentCode
    330799
  • Title

    On the use of diamond in a multichip power module (MCPM) based induction motor drive

  • Author

    Olejniczak, K.J. ; Malshe, A.P. ; Gumaste, Vijaylaxmi

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Arkansas Univ., Little Rock, AR, USA
  • Volume
    2
  • fYear
    1998
  • fDate
    12-15 Oct. 1998
  • Firstpage
    1097
  • Abstract
    The unique combination of excellent thermal, electrical, and mechanical properties makes synthetic diamond a legitimate material candidate for thermal management strategies in integrated drive modules. Over the past several years, joint research programs between academe have resulted in substantial diamond synthesis and post-synthesis processing time and cost, This is largely attributed to major advances in diamond synthesis using chemical vapor deposition (CVD) techniques. In this paper, an overview of diamond synthesis and post-synthesis processing is presented followed by a comparison of thermal heat spreading efficacy of silicon and CVD-diamond substrates for power electronic applications.
  • Keywords
    CVD coatings; chemical vapour deposition; cutting; diamond; induction motor drives; multichip modules; polishing; substrates; thermal management (packaging); ANSYS model; C; CVD; CVD-diamond substrate; Si; chemical vapor deposition; diamond cutting; diamond drilling; diamond planarisation; diamond polishing; induction motor drive; integrated drive modules; metallisation; multichip power module; post-synthesis processing; power electronic application; silicon substrate; synthetic diamond; thermal heat spreading efficacy; thermal management strategies; Application specific integrated circuits; Electronic packaging thermal management; Energy management; Induction motor drives; Multichip modules; Power electronics; Power system management; Substrates; Thermal management; Thermal management of electronics;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industry Applications Conference, 1998. Thirty-Third IAS Annual Meeting. The 1998 IEEE
  • Conference_Location
    St. Louis, MO, USA
  • ISSN
    0197-2618
  • Print_ISBN
    0-7803-4943-1
  • Type

    conf

  • DOI
    10.1109/IAS.1998.730284
  • Filename
    730284