DocumentCode :
330799
Title :
On the use of diamond in a multichip power module (MCPM) based induction motor drive
Author :
Olejniczak, K.J. ; Malshe, A.P. ; Gumaste, Vijaylaxmi
Author_Institution :
Dept. of Electr. & Comput. Eng., Arkansas Univ., Little Rock, AR, USA
Volume :
2
fYear :
1998
fDate :
12-15 Oct. 1998
Firstpage :
1097
Abstract :
The unique combination of excellent thermal, electrical, and mechanical properties makes synthetic diamond a legitimate material candidate for thermal management strategies in integrated drive modules. Over the past several years, joint research programs between academe have resulted in substantial diamond synthesis and post-synthesis processing time and cost, This is largely attributed to major advances in diamond synthesis using chemical vapor deposition (CVD) techniques. In this paper, an overview of diamond synthesis and post-synthesis processing is presented followed by a comparison of thermal heat spreading efficacy of silicon and CVD-diamond substrates for power electronic applications.
Keywords :
CVD coatings; chemical vapour deposition; cutting; diamond; induction motor drives; multichip modules; polishing; substrates; thermal management (packaging); ANSYS model; C; CVD; CVD-diamond substrate; Si; chemical vapor deposition; diamond cutting; diamond drilling; diamond planarisation; diamond polishing; induction motor drive; integrated drive modules; metallisation; multichip power module; post-synthesis processing; power electronic application; silicon substrate; synthetic diamond; thermal heat spreading efficacy; thermal management strategies; Application specific integrated circuits; Electronic packaging thermal management; Energy management; Induction motor drives; Multichip modules; Power electronics; Power system management; Substrates; Thermal management; Thermal management of electronics;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Industry Applications Conference, 1998. Thirty-Third IAS Annual Meeting. The 1998 IEEE
Conference_Location :
St. Louis, MO, USA
ISSN :
0197-2618
Print_ISBN :
0-7803-4943-1
Type :
conf
DOI :
10.1109/IAS.1998.730284
Filename :
730284
Link To Document :
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