Designed experiment to assess flip-chip-on-board reliability

Author

Yegnasubramanian, Mani S. ; Deshmukh, Rashmi ; Fanucci, R. ; Gannon, J. ; Serafino, A. ; Morris, J.R.

Author_Institution

AT&T Bell Labs., Princeton, NJ, USA

fYear

1998

fDate

19-21 Oct 1998

Firstpage

16

Lastpage

23

Abstract

This paper presents the results of a systematic approach to evaluate the reliability performance of flip chip assemblies on organic substrates using underfill. An experiment involving 11 cells with variations in (a) chip size, (b) substrate thickness, (c) underfill materials, (d) test conditions and (e) passivation layer was designed to optimize the assembly variables and to evaluate reliability performance. The experimental variables were chosen to account for reasonable spread in the strain energies of the assemblies to understand the functional dependence of reliability performance. Failure mode analysis (FMA) suggests delamination of the underfill from the chip surface as the primary failure mode, even though several other failure modes such as chip cracking, substrate cracking, and under-bump-metallurgy defects, were also seen

Keywords

assembling; chip-on-board packaging; cracks; delamination; design of experiments; encapsulation; failure analysis; flip-chip devices; integrated circuit packaging; integrated circuit reliability; integrated circuit testing; passivation; assembly variables optimization; chip cracking; chip size; chip surface; designed experiment; failure mode analysis; failure modes; flip chip assemblies; flip-chip-on-board reliability; organic substrates; passivation layer; primary failure mode; reliability performance; reliability performance functional dependence; strain energy; substrate cracking; substrate thickness; test conditions; under-bump-metallurgy defects; underfill; underfill delamination; underfill materials; Assembly systems; Capacitive sensors; Delamination; Design optimization; Failure analysis; Flip chip; Materials reliability; Materials testing; Passivation; Surface cracks;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Manufacturing Technology Symposium, 1998. Twenty-Third IEEE/CPMT

Conference_Location

Austin, TX

ISSN

1089-8190

Print_ISBN

0-7803-4523-1

Type

conf

DOI

10.1109/IEMT.1998.731003

Filename

731003