DocumentCode :
3308596
Title :
Copyright page
fYear :
2005
fDate :
11-14 Dec. 2005
Firstpage :
1
Lastpage :
1
Abstract :
Copyright and Reprint Permissions: Abstracting is permitted with credit to the source. Libraries may photocopy beyond the limits of US copyright law, for private use of patrons, those articles in this volume that carry a code at the bottom of the first page, provided that the per-copy fee indicated in the code is paid through the Copyright Clearance Center. The papers in this book comprise the proceedings of the meeting mentioned on the cover and title page. They reflect the authors´ opinions and, in the interests of timely dissemination, are published as presented and without change. Their inclusion in this publication does not necessarily constitute endorsement by the editors or the Institute of Electrical and Electronics Engineers, Inc.
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Materials and Packaging, 2005. EMAP 2005. International Symposium on
Conference_Location :
Tokyo, Japan
Print_ISBN :
1-4244-0107-0
Type :
conf
DOI :
10.1109/EMAP.2005.1598219
Filename :
1598219
Link To Document :
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