Title :
Reliability assessments of BGA solder joints under cyclic bending loads
Author :
Kim, Ilho ; Lee, Soon-Bok
Author_Institution :
Dept. of Mech. Eng., Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea
Abstract :
Mobile products, such as cellular phones, PDA and notebook, are subjected to many different mechanical loads, which include bending, twisting, impact shock and vibration. In this study, a cyclic bending test of the BGA package was performed to evaluate the fatigue life. Special bending tester, which was suitable for electronic package, was developed using an electromagnetic actuator. A nonlinear finite element model was used to simulate the mechanical bending deformation of solder joint in BGA packages. The fatigue life of lead-free (95.5Sn4.0Ag0.5Cu) solder joints was compared with that of lead-contained (63Sn37Pb). When the applied load to the specimen is small, the lead-free solder has longer fatigue life than lead-contained solder.
Keywords :
ball grid arrays; bending; copper alloys; fatigue testing; finite element analysis; lead alloys; life testing; reliability; silver alloys; solders; tin alloys; BGA package; BGA solder joints; SnAgCu; SnPb; cyclic bending test; electromagnetic actuator; electronic packages; fatigue life evaluation; lead-free solders; mechanical bending deformation; nonlinear finite element model; reliability assessment; Cellular phones; Deformable models; Electric shock; Electronics packaging; Environmentally friendly manufacturing techniques; Fatigue; Lead; Life testing; Soldering; Vibrations;
Conference_Titel :
Electronics Materials and Packaging, 2005. EMAP 2005. International Symposium on
Print_ISBN :
1-4244-0107-0
DOI :
10.1109/EMAP.2005.1598230
