Reliability assessments of BGA solder joints under cyclic bending loads

Author

Kim, Ilho ; Lee, Soon-Bok

Author_Institution

Dept. of Mech. Eng., Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea

fYear

2005

fDate

11-14 Dec. 2005

Firstpage

27

Lastpage

32

Abstract

Mobile products, such as cellular phones, PDA and notebook, are subjected to many different mechanical loads, which include bending, twisting, impact shock and vibration. In this study, a cyclic bending test of the BGA package was performed to evaluate the fatigue life. Special bending tester, which was suitable for electronic package, was developed using an electromagnetic actuator. A nonlinear finite element model was used to simulate the mechanical bending deformation of solder joint in BGA packages. The fatigue life of lead-free (95.5Sn4.0Ag0.5Cu) solder joints was compared with that of lead-contained (63Sn37Pb). When the applied load to the specimen is small, the lead-free solder has longer fatigue life than lead-contained solder.

Keywords

ball grid arrays; bending; copper alloys; fatigue testing; finite element analysis; lead alloys; life testing; reliability; silver alloys; solders; tin alloys; BGA package; BGA solder joints; SnAgCu; SnPb; cyclic bending test; electromagnetic actuator; electronic packages; fatigue life evaluation; lead-free solders; mechanical bending deformation; nonlinear finite element model; reliability assessment; Cellular phones; Deformable models; Electric shock; Electronics packaging; Environmentally friendly manufacturing techniques; Fatigue; Lead; Life testing; Soldering; Vibrations;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Materials and Packaging, 2005. EMAP 2005. International Symposium on

Print_ISBN

1-4244-0107-0

Type

conf

DOI

10.1109/EMAP.2005.1598230

Filename

1598230