DocumentCode
3308760
Title
Case studies of reliability analysis by stochastic methodology in BGA creep analysis
Author
Sasaki, Shoji ; Tateishi, Motoharu ; Ishikawa, Isamu ; Vanderwalt, Paul
Author_Institution
MSC. Software Ltd., Tokyo, Japan
fYear
2005
fDate
11-14 Dec. 2005
Firstpage
33
Lastpage
36
Abstract
Today, structural analysis has been essential at the design stage. Most of the analyses done at the design stage are so simple that the designers find certain results under certain condition, with a simple material constant, at a certain loading conditions, although the material constants have scatters from lot to lot, the dimensions of the part are acceptable with some amount of tolerance in real world. So, the results lead by such analyses does not always match the actual behavior of a group of mass-produced parts. MSC.RobustDesign is a software tool based on stochastic methodology combined with a finite element analysis that makes it possible to include uncertainty into the finite element analysis. In this discussion, some case studies of reliability analysis with MSC.RobustDesign applied to the BGA creep analysis that shows highly nonlinear material behavior.
Keywords
ball grid arrays; creep; electronic engineering computing; failure analysis; finite element analysis; reliability; software tools; stochastic processes; BGA creep analysis; MSC.RobustDesign software tool; finite element analysis; material constant; nonlinear material behavior; reliability analysis; stochastic methodology; structural analysis; Computer aided software engineering; Creep; Finite element methods; Scattering; Software tools; Stochastic processes; Temperature dependence; Thermal loading; Transient analysis; Uncertainty;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Materials and Packaging, 2005. EMAP 2005. International Symposium on
Print_ISBN
1-4244-0107-0
Type
conf
DOI
10.1109/EMAP.2005.1598231
Filename
1598231
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