Title :
Thermoelectric properties and structures of the sintered compact of Cu:Sn:S = 8:1:4 composition
Author :
Hasaka, M. ; Morimura, T. ; Aki, T. ; Kondo, S.
Author_Institution :
Dept. of Mater. Sci. & Eng., Nagasaki Univ., Japan
Abstract :
The compact of Cu:Sn:S=8:1:4 composition was prepared by sintering. The thermoelectric properties of the compact were measured as a function of temperature and annealing period. The microstructures were investigated by X-ray diffraction experiments and transmission electron microscopic observation. The compact is desirable in thermoelectric properties and thermal stability below 450 K. The compact consists of mixtures of several compound structures.
Keywords :
X-ray diffraction; annealing; copper compounds; crystal microstructure; semiconductor materials; sintering; thermal stability; thermoelectricity; tin compounds; transmission electron microscopy; Cu-Sn-S; X-ray diffraction; annealing; compound structures; microstructures; mixtures; sintered compact; structures; temperature; thermal stability; thermoelectric properties; transmission electron microscopic observation; Argon; Conductivity; Cooling; Force measurement; Heating; Microstructure; Temperature; Thermal force; Thermoelectricity; X-ray diffraction;
Conference_Titel :
Thermoelectrics, 1996., Fifteenth International Conference on
Conference_Location :
Pasadena, CA, USA
Print_ISBN :
0-7803-3221-0
DOI :
10.1109/ICT.1996.553282
