Title :
Evaluation of fatigue strength for solder joints after thermal aging
Author :
Miyazaki, Takeshi ; Oomiya, Masaki ; Inoue, Hirotsugu ; Kishimoto, Kikuo ; Amagai, Masazumi
Author_Institution :
Dept. of Mech. & Control Eng., Tokyo Inst. of Technol., Japan
Abstract :
Recently, preventing environmental pollutions, leadfree (Pb-free) solders are about to replace tin-lead (Sn-Pb) eutectic solders. Sn-Ag-Cu alloys are leading candidates for lead free solders. In this study, we carried out board level fatigue tests and investigated the fatigue life of several lead free solder joints. Also, the effects of pad finish metals and their thickness were investigated.
Keywords :
ageing; copper alloys; fatigue testing; life testing; silver alloys; solders; thermal stress cracking; tin alloys; SnAgCu; fatigue life; fatigue strength evaluation; lead free solder joints; leadfree solders; level fatigue tests; pad finish metals; thermal aging; tin-lead eutectic solders; Aging; Copper; Electronics packaging; Environmentally friendly manufacturing techniques; Fatigue; Gold; Lead; Life testing; Soldering; Temperature;
Conference_Titel :
Electronics Materials and Packaging, 2005. EMAP 2005. International Symposium on
Print_ISBN :
1-4244-0107-0
DOI :
10.1109/EMAP.2005.1598264
