DocumentCode
3309374
Title
Evaluation of fatigue strength for solder joints after thermal aging
Author
Miyazaki, Takeshi ; Oomiya, Masaki ; Inoue, Hirotsugu ; Kishimoto, Kikuo ; Amagai, Masazumi
Author_Institution
Dept. of Mech. & Control Eng., Tokyo Inst. of Technol., Japan
fYear
2005
fDate
11-14 Dec. 2005
Firstpage
215
Lastpage
219
Abstract
Recently, preventing environmental pollutions, leadfree (Pb-free) solders are about to replace tin-lead (Sn-Pb) eutectic solders. Sn-Ag-Cu alloys are leading candidates for lead free solders. In this study, we carried out board level fatigue tests and investigated the fatigue life of several lead free solder joints. Also, the effects of pad finish metals and their thickness were investigated.
Keywords
ageing; copper alloys; fatigue testing; life testing; silver alloys; solders; thermal stress cracking; tin alloys; SnAgCu; fatigue life; fatigue strength evaluation; lead free solder joints; leadfree solders; level fatigue tests; pad finish metals; thermal aging; tin-lead eutectic solders; Aging; Copper; Electronics packaging; Environmentally friendly manufacturing techniques; Fatigue; Gold; Lead; Life testing; Soldering; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Materials and Packaging, 2005. EMAP 2005. International Symposium on
Print_ISBN
1-4244-0107-0
Type
conf
DOI
10.1109/EMAP.2005.1598264
Filename
1598264
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