DocumentCode :
3309390
Title :
Local thermal deformation and residual stress of a thin Si chip mounted on a substrate using an area-arrayed flip chip structure
Author :
Miura, Hideo ; Ueta, Nobuki ; Sato, Yuhki
Author_Institution :
Graduate Sch. of Eng., Tohoku Univ., Miyagi, Japan
fYear :
2005
fDate :
11-14 Dec. 2005
Firstpage :
220
Lastpage :
225
Abstract :
Mechanical reliability issues such as cracking of LSI chips and deterioration of electronic performance of them caused by mechanical stress and strain in multi devices sub-assembly (MDS) structures were discussed analytically and experimentally. Local thermal deformation due to thinning of the LSI chips for mobile application causes large distribution of residual stress from -300 MPa to +150 MPa in the chips. The values of the maximum and the minimum stresses are strong function of the thickness of the LSI chips. In flip chip assembly structures, high tensile stress occurs near the edge of the back surface of the chips and at the edge of small bumps. High compressive stress remains in the center area of the thinner chips because of the reduction of their cross section. Such a wide range of the residual stress causes wide distribution of the shift of electronic performances of devices. Therefore, it is very important to optimize the MDS structures to improve the reliability of products.
Keywords :
deformation; elemental semiconductors; flip-chip devices; integrated circuit reliability; internal stresses; large scale integration; silicon; -300 to 150 MPa; LSI chips; Si; area-arrayed flip chip structure; high compressive stress; local thermal deformation; mechanical reliability; mechanical strain; mechanical stress; multidevices sub-assembly; residual stress; thin silicon chip; Assembly; Capacitive sensors; Compressive stress; Dielectric materials; Flip chip; Large scale integration; Packaging; Residual stresses; Tensile stress; Thermal stresses;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Materials and Packaging, 2005. EMAP 2005. International Symposium on
Print_ISBN :
1-4244-0107-0
Type :
conf
DOI :
10.1109/EMAP.2005.1598265
Filename :
1598265
Link To Document :
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