• DocumentCode
    3309514
  • Title

    Evaluation of drop impact load for portable electronic components

  • Author

    Omori, Takahiro ; Inoue, Hirotsugu ; Kawamura, Noriyasu ; Mukai, Minoru ; Kishimoto, Kikuo ; Kawakami, Takashi

  • Author_Institution
    Corporate R&D Center, Toshiba Corp., Kawasaki, Japan
  • fYear
    2005
  • fDate
    11-14 Dec. 2005
  • Firstpage
    262
  • Lastpage
    267
  • Abstract
    A method to predict impact load caused by the collision of two rods is investigated in this paper. To obtain normal impact load, Hertzian law is applied to express the contact compliance. Frictional force and deformation of two bodies are also taken into account. Some drop impact tests and simulations are performed with several heights and positions to verify the modeling. The results of comparing analysis with experiment show that frictional force and deformation of two rods greatly affect the impact load. It is noted that the finite element method can also predict the impact load and that slipping and sticking between two rods during impact are likely to affect the impact load.
  • Keywords
    deformation; electronic products; finite element analysis; friction; impact testing; Hertzian law; contact compliance; drop impact load; drop impact tests; finite element method; frictional force; normal impact load; portable electronic components; rod deformation; Acceleration; Deformable models; Electronic components; Finite element methods; Liquid crystal displays; Motion analysis; Steel; Strain measurement; Testing; Transient analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Materials and Packaging, 2005. EMAP 2005. International Symposium on
  • Print_ISBN
    1-4244-0107-0
  • Type

    conf

  • DOI
    10.1109/EMAP.2005.1598273
  • Filename
    1598273