Title :
A study in establishing flip-chip ball grid array (FCBGA) second level interconnect (SLI) reliability requirement by CFD simulation
Author :
Kwong, Lee Eng ; Aun, Tan Wooi
Author_Institution :
Intel Technol., Penang, Malaysia
Abstract :
CFD simulation using commercial tool such as Flotherm has been carried out to analyze the solder ball temperature (Tsb) in different regions underneath a FCBGA package in order to establish and characterize the second level interconnect (SLI) reliability requirement of the package. The package details and the mechanical load on the package directly affect Tsb and the thermal fatigue locus. The Tsb is used to correlate with the modified Coffin-Manson model in order to assess the package SLI solder joint reliability performance under temperature cycling stress.
Keywords :
ball grid arrays; computational fluid dynamics; flip-chip devices; interconnections; reliability; solders; thermal stress cracking; CFD simulation; FCBGA package; flip-chip ball grid array; mechanical load; modified Coffin-Manson model; second level interconnect reliability; solder ball temperature; solder joint reliability; temperature cycling stress; thermal fatigue locus; Computational fluid dynamics; Cooling; Electronics packaging; Fatigue; Heat sinks; Semiconductor device packaging; Silicon; Soldering; Temperature; Thermal management;
Conference_Titel :
Electronics Materials and Packaging, 2005. EMAP 2005. International Symposium on
Print_ISBN :
1-4244-0107-0
DOI :
10.1109/EMAP.2005.1598278
