DocumentCode
330974
Title
Improvement of short primary member linear induction motor performance by partial adoption of the wound secondary
Author
Onuki, T. ; Kamiya, Y. ; Iraha, T. ; Fukaya, K. ; Jeon, W.
Author_Institution
Dept. of Electr. Electron. & Comput. Eng., Waseda Univ., Tokyo, Japan
Volume
1
fYear
1998
fDate
12-15 Oct. 1998
Firstpage
179
Abstract
In this paper, the authors propose the partial adoption of wound secondary members in single-sided linear motors with short primary members. Adopting this scheme in sections where the light driving or braking force is required, desirable performance can be obtained by controlling secondary resistances. Here, they deal with the various scheme of primary and secondary winding connection in the proposed scheme. Further, by using three-dimensional analysis, they also clarify various transient phenomena at the time when the primary crosses the boundary between the solid-plate secondary section and the wound secondary one. As a result, independent short-circuited connection is appropriate for the secondary winding owing to its superior performance and simple structure. Parallel connection is also appropriate for the primary winding owing to its stable transient performance when the primary crosses a boundary of different secondary structures. Moreover, the authors propose a novel boundary structure, which yields stable transient performances.
Keywords
linear induction motors; machine testing; machine theory; machine windings; transients; boundary structure; braking force; driving force; independent short-circuited connection; performance improvement; primary winding; secondary resistance control; short primary member LIM; single-sided linear motors; stable transient performance; three-dimensional analysis; transient phenomena; wound secondary; Circuit analysis; Coils; Conductors; Electric resistance; Equations; Finite element methods; Induction motors; Magnetic analysis; Magnetic fields; Wounds;
fLanguage
English
Publisher
ieee
Conference_Titel
Industry Applications Conference, 1998. Thirty-Third IAS Annual Meeting. The 1998 IEEE
Conference_Location
St. Louis, MO, USA
ISSN
0197-2618
Print_ISBN
0-7803-4943-1
Type
conf
DOI
10.1109/IAS.1998.732283
Filename
732283
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