Title :
Glass passivated chip-early reliability test
Author :
Bucheru, B.T. ; Turtudau, F. ; Ichim, Any ; Iosif, R. ; Marinescu, V.A.
Author_Institution :
S.C. Baneasa S.A., Bucharest, Romania
Abstract :
The paper presents a method for the estimation of product reliability based on tests performed at the chip fabrication stage, which is time and money saving for manufacturer. It relates to the manufacture of automotive rectifier diodes in DO21 case. The aim was to establish to a correlation between the pressure resistance of chips and the results of standard reliability test, RTV (rapid thermal variations)
Keywords :
automotive electronics; passivation; power semiconductor diodes; semiconductor device reliability; semiconductor device testing; solid-state rectifiers; DO21; automotive rectifier diode; chip fabrication; glass passivation; pressure resistance; rapid thermal variations; reliability test; Assembly; Automotive engineering; Glass; Performance evaluation; Semiconductor device manufacture; Semiconductor diodes; Silicon; Stress; Testing; Thermal resistance;
Conference_Titel :
Semiconductor Conference, 1998. CAS '98 Proceedings. 1998 International
Conference_Location :
Sinaia
Print_ISBN :
0-7803-4432-4
DOI :
10.1109/SMICND.1998.732364
