• DocumentCode
    3312136
  • Title

    1200V IGBTs operating at 200°C? An investigation on the potentials and the design constraints

  • Author

    Schlapbach, U. ; Rahimo, M. ; von Arx, C. ; Mukhitdinov, A. ; Linder, S.

  • Author_Institution
    ABB Switzerland Ltd, Lenzburg
  • fYear
    2007
  • fDate
    27-31 May 2007
  • Firstpage
    9
  • Lastpage
    12
  • Abstract
    The targeted 175degC junction temperature limit for the next generation of 1200 V IGBT requires safe and reliable operation of the devices at a temperature of 200degC. Due to the exponential scaling of several IGBT parameters, such high temperatures will subject the IGBT to new levels of stress, guiding chip designers and application people onto completely new grounds whose firmness is largely unknown. In this paper, we take some first steps by investigating the operation of 1200 V IGBTs at temperatures up to 200degC, looking at their characteristics, trying to understand potentials and possible threats, and drawing initial conclusions how such devices must be dimensioned in order to operate safely.
  • Keywords
    insulated gate bipolar transistors; integrated circuit design; IGBT; chip design; power handling capability; power semiconductors; temperature 200 degC; voltage 1200 V; Cooling; Insulated gate bipolar transistors; Leakage current; Performance loss; Power semiconductor devices; Semiconductor device reliability; Stability criteria; Stress; Temperature distribution; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Semiconductor Devices and IC's, 2007. ISPSD '07. 19th International Symposium on
  • Conference_Location
    Jeju Island
  • Print_ISBN
    1-4244-1095-9
  • Electronic_ISBN
    1-4244-1096-7
  • Type

    conf

  • DOI
    10.1109/ISPSD.2007.4294919
  • Filename
    4294919