• DocumentCode
    3312452
  • Title

    Virtual metrology algorithm for TFT-LCD manufacutring process

  • Author

    Bi-Qi Sheng ; Tian-Hong Pan

  • Author_Institution
    Sch. of Electr. & Inf. Eng., Jiangsu Univ., Zhenjiang, China
  • Volume
    4
  • fYear
    2011
  • fDate
    26-28 July 2011
  • Firstpage
    2142
  • Lastpage
    2145
  • Abstract
    In TFT-LCD manufacturing process, virtual metrology (VM) model is often employed to predict product´s quality variables using sensor variables. However, modern industrial processes are usually equipped with a large number of sensors that provide process variables data such as pressure, temperature, spectroscopic signals, heat or power supplied, etc. So, how to design a validated VM model is the key problem. In this paper, a novel approach is presented to overcome the problem of high dimensionality and collinearity in the process variables data. Firstly, canonical correlation analysis is used to overcome the collinearity of the variables measured or quality variables. Moving time window is also considered to resolve the process uncertainty. For the purpose of reducing computation cost, a reliance index is developed to determine the frequency of model´s parameters updating. Superiority of the proposed model is also presented when it applied to an industrial sputtering process.
  • Keywords
    correlation theory; liquid crystal displays; manufacturing processes; sensors; spectroscopy; thin film transistors; virtual manufacturing; TFT-LCD manufacutring process; VM model; canonical correlation analysis; industrial sputtering process; model parameter; moving time window; reliance index; sensor variable; spectroscopic signal; virtual metrology algorithm; Computational modeling; Correlation; Indexes; Manufacturing processes; Metrology; Predictive models; Sputtering; canonical correlation analysis; moving time window; reliance index; virtual metrology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Fuzzy Systems and Knowledge Discovery (FSKD), 2011 Eighth International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-61284-180-9
  • Type

    conf

  • DOI
    10.1109/FSKD.2011.6019961
  • Filename
    6019961