DocumentCode :
3312537
Title :
Buried Gate Static Induction Transistors in 4H-SiC (SiC-BGSITs) with Ultra Low On-Resistance
Author :
Tanaka, Yasunori ; Yano, Koji ; Okamoto, Mitsuo ; Takatsuka, Akio ; Arai, Kazuo ; Yatsuo, Tsutomu
Author_Institution :
Nat. Inst. of Adv. Ind. Sci. & Technol. (AIST), Ibaraki
fYear :
2007
fDate :
27-31 May 2007
Firstpage :
93
Lastpage :
96
Abstract :
Ultra low on-resistance silicon carbide static induction transistors with buried gate structures (SiC-BGSITs) have been successfully developed. A submicron buried p+ gate structure was fabricated by the combination of submicron trench dry etching and epitaxial growth on a trench structure. A drain current IDS reached 8 A at a drain voltage VDS = 1 V, corresponding to a specific on-resistance RonS of 1.1 mOmegamiddotcm2 at a current density JD = 200 A/cm2, in the BGSIT with the channel width Wch of 0.9 mum. A breakdown voltage VBR was ~700 V at a negative gate bias VG = -12 V. A clear saturation IDS-VDS characteristic and slightly high RonS (1.4 mOmegamiddotcm2) were observed in the BGSIT with narrow Wch of 0.7 mum. RonS increased in proportion to T2,3 in any channel width due to enhanced phonon scattering.
Keywords :
etching; power field effect transistors; silicon compounds; static induction transistors; 4H-SiC; SiC; breakdown voltage; buried gate structures; current density; drain current; drain voltage; epitaxial growth; phonon scattering; saturation characteristic; silicon carbide static induction transistors; size 0.7 mum; submicron trench dry etching; ultra low on-resistance transistors; voltage -12 V; voltage 1 V; Biomedical engineering; Dry etching; Electronics industry; FETs; JFETs; Power electronics; Power engineering and energy; Power semiconductor devices; Silicon carbide; Transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Semiconductor Devices and IC's, 2007. ISPSD '07. 19th International Symposium on
Conference_Location :
Jeju Island
Print_ISBN :
1-4244-1095-9
Electronic_ISBN :
1-4244-1096-7
Type :
conf
DOI :
10.1109/ISPSD.2007.4294940
Filename :
4294940
Link To Document :
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