• DocumentCode
    3312925
  • Title

    SEMG-based continuous posture recognition of elbow flexion and extension in sagittal plane

  • Author

    Zhibin Song ; Zhenyu Wang ; Shuxiang Guo

  • Author_Institution
    Beijing Inst. of Technol., Beijing, China
  • fYear
    2013
  • fDate
    4-7 Aug. 2013
  • Firstpage
    920
  • Lastpage
    925
  • Abstract
    Surface electromyographic signal (sEMG) is used in some fields such as human machine interaction and measurement of human motor function, because it can reflect the activation of human muscle. Though the recognition of motion pattern of human limbs has been researched for many years, continuous recognition for human elbow motion without load is still difficult because of low signal noise ratio (SNR). In this paper, we proposed an improved weighted peaks method to process the filtered sEMG signals from the biceps muscle and adapted linear fitting method to obtain the elbow motion in sagittal plane. The experiments showed the proposed method can effectively process the sEMG signals and obtain the activation of biceps muscle. The experimental results show the similar data of elbow motion compared to the data derived from an inertia sensor.
  • Keywords
    adaptive signal processing; electromyography; filtering theory; medical signal processing; pattern recognition; signal denoising; adapted linear fitting method; biceps muscle; elbow extension; elbow flexion; filtered sEMG signal processing; human elbow motion; human limbs; human machine interaction; human motor function measurement; human muscle activation; inertia sensor; low-signal noise ratio; motion pattern recognition; sEMG-based continuous posture recognition; sagittal plane; surface electromyographic signal; weighted peaks method; Elbow; Electrodes; Feature extraction; Frequency-domain analysis; Muscles; Wavelet packets; Improved Weighted Peaks; Recognition for motion pattern; SEMG;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Mechatronics and Automation (ICMA), 2013 IEEE International Conference on
  • Conference_Location
    Takamatsu
  • Print_ISBN
    978-1-4673-5557-5
  • Type

    conf

  • DOI
    10.1109/ICMA.2013.6618038
  • Filename
    6618038