• DocumentCode
    3313660
  • Title

    Temperature analysis of thermoelectric device of Cu4SnS4 with two dimension by boundary element method

  • Author

    Kondo, S. ; Hasaka, M. ; Morimura, T.

  • Author_Institution
    Dept. of Mater. Sci. & Eng., Nagasaki Univ., Japan
  • fYear
    1996
  • fDate
    26-29 March 1996
  • Firstpage
    238
  • Lastpage
    242
  • Abstract
    Temperature distribution of a thermoelectric device composed of Cu/sub 4/SnS/sub 4/ compound in two-dimension is evaluated by the boundary element method (BEM). It is found that temperature distribution is strongly dependent on the length of the thermoelectric device. Temperature distribution shows very strong dependence of the direction of length of device when the length of device is very thin. In the case of small electric current density such as -1 A/cm/sup 2/, temperature distribution can be approximately expressed as the solution of Laplace equation.
  • Keywords
    Laplace equations; boundary-elements methods; copper compounds; current density; temperature distribution; thermoelectric devices; tin compounds; Cu/sub 4/SnS/sub 4/; Laplace equation; boundary element method; small electric current density; temperature distribution; thermoelectric device; two-dimensions; Conductivity measurement; Electric resistance; Electric variables measurement; Electrical resistance measurement; Force measurement; Length measurement; Temperature dependence; Temperature distribution; Thermal conductivity; Thermoelectric devices;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermoelectrics, 1996., Fifteenth International Conference on
  • Conference_Location
    Pasadena, CA, USA
  • Print_ISBN
    0-7803-3221-0
  • Type

    conf

  • DOI
    10.1109/ICT.1996.553307
  • Filename
    553307
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3313660