• DocumentCode
    3314684
  • Title

    An experimental study to investigate the effects of partial discharges (PD), of electric field and of relative humidity during surface PD tests on thin polymer films

  • Author

    Centurioni, L. ; Coletti, G. ; Guastavino, F.

  • Author_Institution
    Dipartimento di Ingegneria Elettrica, Genova Univ., Italy
  • fYear
    1999
  • fDate
    1999
  • Firstpage
    239
  • Abstract
    It is possible to conceive that the degradation of thin polymer films subjected to surface partial discharges (PD) is due both to the direct PD action and to an electrical aging process due to the electric field acting in the film below the target micro-areas of PD during the instants of discharges. Therefore an innovative testing procedure has been implemented to check such an assertion. Three different polyimide 25 μm thick films have been selected for the surface PD tests. Such tests have been carried out at different humidities till breakdown of the films. The results (lifetimes) obtained in the present case showed no evidence of a contribution of the above electrical aging factor to the films degradation. However this outcome cannot be generalised, as the electrical aging phenomena depends both on the thickness and on the dielectric strength of the films under consideration. When necessary, the testing procedure presented here can be applied to check the situation
  • Keywords
    electric strength; humidity; organic insulating materials; partial discharges; polymer films; 25 mum; dielectric strength; electrical aging; film thickness; polyimide; relative humidity; surface partial discharge tests; thin polymer films; Aging; Electric breakdown; Humidity; Partial discharges; Polyimides; Polymer films; Surface discharges; Testing; Thermal degradation; Thick films;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena, 1999 Annual Report Conference on
  • Conference_Location
    Austin, TX
  • Print_ISBN
    0-7803-5414-1
  • Type

    conf

  • DOI
    10.1109/CEIDP.1999.804635
  • Filename
    804635