Title :
CFD thermal analysis of a telecommunication board
Author :
Abakr, Y.A. ; Ahmed, M.I. ; Ismail, A.F.
Author_Institution :
Fac. of Eng., HUM, Kuala Lumpur, Malaysia
Abstract :
A telecommunications electronic circuit board´s cooling requirements are studied using CFD (computational fluid dynamics). A mathematical model is developed in order to simulate thermal performance, including radiation, conduction and convection heat transfer. A steady state simulation was carried out using Fluent CFD software and the results were compared with full-sized experimental measurements, which were conducted previously.
Keywords :
computational fluid dynamics; convection; digital simulation; heat conduction; heat radiation; telecommunication equipment testing; thermal analysis; CFD thermal analysis; computational fluid dynamics; conduction; convection; cooling requirements; electronic circuit board; heat transfer; radiation; telecommunication board; Circuit simulation; Computational fluid dynamics; Computational modeling; Electronic circuits; Electronics cooling; Heat transfer; Mathematical model; Software measurement; Steady-state; Thermal conductivity;
Conference_Titel :
Telecommunication Technology, 2003. NCTT 2003 Proceedings. 4th National Conference on
Print_ISBN :
0-7803-7773-7
DOI :
10.1109/NCTT.2003.1188331
