• DocumentCode
    3315546
  • Title

    Physical principles of microminiaturization in thermoelectricity

  • Author

    Anatychuk, L.I. ; Luste, O.J.

  • Author_Institution
    Inst. of Thermoelectr., Chernivtsi, Ukraine
  • fYear
    1996
  • fDate
    26-29 March 1996
  • Firstpage
    279
  • Lastpage
    287
  • Abstract
    Factors, which promote microminiaturization of cooling modules have been considered. Results of thermoelectric cooler investigations are presented taking into account all classical factors: electrical and heat resistance of a commutation, contact resistance, heat resistance of heat transfers, all kinds of thermoelectric effects, temperature dependencies of material properties, etc. The influence of all factors on cooling efficiency is analyzed. New factors, which can have influence on a module work, namely strong electric field, large temperature gradient, size effects, and diffusion processes are considered. The influence on microminiaturization and conditions for these factors actions are analyzed. A common analysis for microminiaturization limits and a prognosis of thermoelectric modules development is presented.
  • Keywords
    commutation; contact resistance; cooling; diffusion; heat transfer; thermal resistance; thermoelectric devices; thermoelectricity; commutation; contact resistance; cooling efficiency; cooling modules; diffusion processes; electrical resistance; heat resistance; heat transfer; material properties; microminiaturization; size effects; strong electric field; temperature dependencies; temperature gradient; thermoelectric cooler; thermoelectric effects; thermoelectricity; Contact resistance; Cooling; Diffusion processes; Electric resistance; Heat transfer; Material properties; Resistance heating; Temperature dependence; Thermal resistance; Thermoelectricity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermoelectrics, 1996., Fifteenth International Conference on
  • Conference_Location
    Pasadena, CA, USA
  • Print_ISBN
    0-7803-3221-0
  • Type

    conf

  • DOI
    10.1109/ICT.1996.553318
  • Filename
    553318