Title :
3D dynamic monitoring of collapse area based on CMS-Surpac
Author :
Liu, Xiao-Ming ; Luo, Zhou-Quan ; Chen, Qing-Fa ; Zhang, Xun-Fang ; Zhu, Qing-Ling
Author_Institution :
Sch. of Resources & Safety Eng., Central South Univ., Changsha, China
Abstract :
Combine the actual situation of stope collapse area 56-7# of Dongguashan Copper Mine in china, three-dimensional dynamic monitoring the collapse area twice using Cavity Monitoring System (CMS), taking collapse area measured data as foundation, collapse area three-dimensional model created using Surpac and gain three-dimensional configuration and the actual boundary of the collapse area accurately. Then the bottom structure of stope, the designed stope and ore heap models are established according to the stope design data. Finally, the actual boundary, volume, roof exposure area, collapse range and ore remains of the collapse area are calculated accurately through Boolean operation among the models, a new visible calculation method of integrated information visible calculation for large-scale collapse area is realized effectively. The results show that the longer of the collapse area stay is, the greater of the scope, volume and roof exposure area is. So, it is essential to suspend the blasting around the collapse area and continue to reclaim ore remains. Then backfilling the collapse area and Make plans for reclaim ore body remains.
Keywords :
computerised monitoring; condition monitoring; foundations; geotechnical engineering; maintenance engineering; mining; structural engineering computing; voids (solid); 3D dynamic monitoring; Boolean operation; CMS-Surpac; China; Dongguashan Copper Mine; cavity monitoring system; collapse area monitoring; foundation; mining 3D software Surpac; stope collapse area; Collision mitigation; Copper; Data engineering; Geologic measurements; Large-scale systems; Monitoring; Optical control; Ores; Safety; Stress; Cavity Monitoring System; cavity three-dimensional model; collapse area; deep mine; dynamic monitoring;
Conference_Titel :
Computer Science and Information Technology, 2009. ICCSIT 2009. 2nd IEEE International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-4519-6
Electronic_ISBN :
978-1-4244-4520-2
DOI :
10.1109/ICCSIT.2009.5234777