• DocumentCode
    3316205
  • Title

    Non-contact measurement of sheet resistance and leakage current: applications for USJ-SDE/halo junctions

  • Author

    Faifer, V.N. ; Current, M.I. ; Nguyen, T. ; Wong, T.M.H. ; Souchkov, V.V.

  • Author_Institution
    Frontier Semicond., San Jose, CA, USA
  • fYear
    2005
  • fDate
    7-8 June 2005
  • Firstpage
    45
  • Lastpage
    48
  • Abstract
    A powerful new tool for non-contact analysis of sheet resistance and leakage current in p-n junctions, based on junction photo-voltage analysis of carrier recombination, carrier spreading and loss in the junction, has been developed. The method has been demonstrated to be effective in measurements of p-n junctions from ∼10 nm to >1 nm and over a dose range of ∼1011 to >1015 ions/cm2. RsL metrology is the first tool to provide dose metrology coverage over the full depth and dose range of CMOS transistor doping. The stability of the measurement results in an Rs repeatability for all junction conditions and does not require surface preparation, such as oxide strip, prior to measurement. RsL methods provide direct evaluation of junction leakage current, which is especially useful for shallow junction technology evaluation. The RsL probe has been incorporated into a fully-automated tool for in-line pilot line and production process development and production control applications.
  • Keywords
    CMOS integrated circuits; electrical resistivity; electron-hole recombination; leakage currents; p-n junctions; photovoltaic effects; CMOS transistor doping dose range; RsL metrology; RsL probe; USJ-SDE/halo junction; carrier loss; carrier recombination; carrier spreading; dose metrology; leakage current; noncontact measurement; p-n junction; photovoltage analysis; shallow junction technology; sheet resistance; CMOS technology; Current measurement; Doping; Electrical resistance measurement; Leakage current; Metrology; P-n junctions; Probes; Stability; Strips;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Junction Technology, 2005. Extended Abstracts of the Fifth International Workshop on
  • Print_ISBN
    4-9902158-6-9
  • Type

    conf

  • DOI
    10.1109/IWJT.2005.203876
  • Filename
    1598662