DocumentCode :
3316302
Title :
Drain structure optimization for highly reliable deep submicron nMOSFETs with 3.3 V high performance operation
Author :
Matsuoka, F. ; Kasai, K. ; Oyamatsu, H. ; Kinugawa, M. ; Maeguchi, K.
Author_Institution :
Toshiba Corp., Kawasaki, Japan
fYear :
1990
fDate :
9-12 Dec. 1990
Firstpage :
833
Lastpage :
836
Abstract :
A guideline for optimization of the n/sup -/ fully gate overlapped structure (FOLD) has been established. Its reliability and performance were investigated in comparison with optimized LDD (lightly doped drain) structure (op.LDD). It is found that the superiority in reliability for the two structures is reversed below 3.5 V, and the optimized FOLD structure (op.FOLD) has higher reliability than the op.LDD structure. This is due to a discrepancy between peak electric field and current flow caused by high controllability of the gate electrode of the FOLD structure at the n/sup -/ extension region. The op.FOLD structure achieves high performance on the trend at 3.3 V, in spite of nonscaled gate oxide thickness (11 nm), which results from TDDB limitation for 3.3 V operation.<>
Keywords :
insulated gate field effect transistors; reliability; semiconductor device testing; 3.3 V; FOLD structure; TDDB limitation; current flow; deep submicron nMOSFETs; drain structure optimization; gate electrode controllability; high performance operation; n/sup -/ fully gate overlapped structure; peak electric field; reliability; Controllability; Electrodes; Guidelines;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 1990. IEDM '90. Technical Digest., International
Conference_Location :
San Francisco, CA, USA
ISSN :
0163-1918
Type :
conf
DOI :
10.1109/IEDM.1990.237033
Filename :
237033
Link To Document :
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