DocumentCode :
3316368
Title :
Feasibility study of plasma doping on Si substrates with photo-resist patterns
Author :
Aiba, Issui ; Sasaki, Yuichiro ; Okashita, Katsumi ; Tamura, Hideki ; Fukagawa, Yotaro ; Tsutsui, Kazuo ; Ito, Hiroyuki ; Kakushima, Kuniyuki ; Mizuno, Bunji ; Iwai, Hiroshi
Author_Institution :
Frontier Collaborative Res. Center, Tokyo Inst. of Technol., Yokohama, Japan
fYear :
2005
fDate :
7-8 June 2005
Firstpage :
75
Lastpage :
76
Abstract :
Plasma doping is one of the candidates of the impurity doping processes to form shallow junction. Although the PD is a highly efficient doping process, it would be useful to establish a proper wet cleaning method that follows the PD processes so that the PD can be used in the conventional semiconductor fabrication flow. The effects of the photo-resist masks are examined in conjunction with the PD processes including the retained dose after the removal of the photo-resist using the ashing.
Keywords :
elemental semiconductors; photoresists; plasma materials processing; semiconductor doping; silicon; surface cleaning; Si; ashing; impurity doping; photoresist masks; photoresist patterns; plasma doping; shallow junction; substrates; wet cleaning method; Boron; Cleaning; Collaboration; Plasma measurements; Resists; Scanning electron microscopy; Scanning probe microscopy; Semiconductor device doping; Semiconductor impurities; Substrates;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Junction Technology, 2005. Extended Abstracts of the Fifth International Workshop on
Print_ISBN :
4-9902158-6-9
Type :
conf
DOI :
10.1109/IWJT.2005.203886
Filename :
1598672
Link To Document :
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