3D stacked Si CMOS VLSI smart pixels using through-Si optoelectronic interconnections

Author

Bond, S.W. ; Jung, S. ; Vendier, O. ; Brooke, M.A. ; Jokerst, N.M.

Author_Institution

Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

fYear

1998

fDate

20-24 July 1998

Abstract

We have presented the first demonstration of an optically interconnected three dimensional smart pixel system connecting three stacked layers of Si CMOS VLSI circuitry. We have demonstrated vertical optical communication between three CMOS circuit layers with operation speeds up to 1 Mbps. This system demonstrates the viability of implementing optical interconnections for scalable 3D interconnection systems for ultra-smart pixel applications.

Keywords

CMOS integrated circuits; VLSI; digital signal processing chips; integrated optoelectronics; optical interconnections; silicon; smart pixels; 3D optically interconnected smart pixel system; 3D stacked Si CIMOS VLSI smart pixels; CMOS circuit layers; Si; Si CMOS VLSI circuitry; operation speeds; optical interconnections; scalable 3D interconnection systems; stacked layers; through-Si optoelectronic interconnections; ultra-smart pixel applications; vertical optical communication; CMOS process; Integrated circuit interconnections; Optical films; Optical interconnections; Optical receivers; Optical signal processing; Optical transmitters; Smart pixels; Stimulated emission; Very large scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Broadband Optical Networks and Technologies: An Emerging Reality/Optical MEMS/Smart Pixels/Organic Optics and Optoelectronics. 1998 IEEE/LEOS Summer Topical Meetings

Conference_Location

Monterey, CA, USA

Print_ISBN

0-7803-4953-9

Type

conf

DOI

10.1109/LEOSST.1998.690406

Filename

690406