DocumentCode :
3318009
Title :
Packaging of high resolution Si based spatial light modulators for display applications
Author :
Narayan, C. ; Horton, R.
Author_Institution :
IBM Corp., Hopewell Junction, NY, USA
fYear :
1999
fDate :
1999
Firstpage :
402
Lastpage :
409
Abstract :
Si based spatial light modulators (SLM) are a new breed of devices used to form an image on a screen by projecting a reflected image from a Si surface. The device is typically a Si substrate with pixelated mirrors on the surface with a thin film transistor under each pixel. This active matrix array is covered with a thin layer of an electro-optic material and a blanket counter electrode, typically ITO. The image is formed by applying a voltage between the counter electrode and the required pixels. These light modulators can be used as front or rear projectors. Packaging of these SLMs are different from standard packaging of Si chips or standard flat panel display packaging for a variety of reasons that include limited thermal stability of the liquid crystal in the cell, fragility of the Si substrate and high thermal conductivity of Si relative to glass. This work describes aspects of packaging that are unique to Si based light modulators
Keywords :
electro-optical effects; elemental semiconductors; liquid crystal displays; mirrors; semiconductor device packaging; silicon; spatial light modulators; thermal conductivity; thermal stability; ITO; ITO blanket counter electrode; InSnO; SLM; SLMs; Si; Si based spatial light modulators; Si substrate; Si substrate fragility; Si surface; active matrix array; display applications; flat panel display packaging; front projectors; high resolution Si based spatial light modulators; image formation; image projection; liquid crystal stability; packaging; pixelated mirrors; rear projectors; reflected image; thermal stability; thin electro-optic material layer; thin film transistor; Active matrix liquid crystal displays; Counting circuits; Electrodes; Liquid crystal displays; Mirrors; Optical modulation; Packaging; Spatial resolution; Substrates; Thermal conductivity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1999. Twenty-Fourth IEEE/CPMT
Conference_Location :
Austin, TX
ISSN :
1089-8190
Print_ISBN :
0-7803-5502-4
Type :
conf
DOI :
10.1109/IEMT.1999.804852
Filename :
804852
Link To Document :
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