• DocumentCode
    3318009
  • Title

    Packaging of high resolution Si based spatial light modulators for display applications

  • Author

    Narayan, C. ; Horton, R.

  • Author_Institution
    IBM Corp., Hopewell Junction, NY, USA
  • fYear
    1999
  • fDate
    1999
  • Firstpage
    402
  • Lastpage
    409
  • Abstract
    Si based spatial light modulators (SLM) are a new breed of devices used to form an image on a screen by projecting a reflected image from a Si surface. The device is typically a Si substrate with pixelated mirrors on the surface with a thin film transistor under each pixel. This active matrix array is covered with a thin layer of an electro-optic material and a blanket counter electrode, typically ITO. The image is formed by applying a voltage between the counter electrode and the required pixels. These light modulators can be used as front or rear projectors. Packaging of these SLMs are different from standard packaging of Si chips or standard flat panel display packaging for a variety of reasons that include limited thermal stability of the liquid crystal in the cell, fragility of the Si substrate and high thermal conductivity of Si relative to glass. This work describes aspects of packaging that are unique to Si based light modulators
  • Keywords
    electro-optical effects; elemental semiconductors; liquid crystal displays; mirrors; semiconductor device packaging; silicon; spatial light modulators; thermal conductivity; thermal stability; ITO; ITO blanket counter electrode; InSnO; SLM; SLMs; Si; Si based spatial light modulators; Si substrate; Si substrate fragility; Si surface; active matrix array; display applications; flat panel display packaging; front projectors; high resolution Si based spatial light modulators; image formation; image projection; liquid crystal stability; packaging; pixelated mirrors; rear projectors; reflected image; thermal stability; thin electro-optic material layer; thin film transistor; Active matrix liquid crystal displays; Counting circuits; Electrodes; Liquid crystal displays; Mirrors; Optical modulation; Packaging; Spatial resolution; Substrates; Thermal conductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Manufacturing Technology Symposium, 1999. Twenty-Fourth IEEE/CPMT
  • Conference_Location
    Austin, TX
  • ISSN
    1089-8190
  • Print_ISBN
    0-7803-5502-4
  • Type

    conf

  • DOI
    10.1109/IEMT.1999.804852
  • Filename
    804852