DocumentCode
3318236
Title
A 11.7 GHz 1/8-divider using 43 GHz Si high speed bipolar transistor with photoepitaxially grown ultra-thin base
Author
Yamazaki, T. ; Namura, I. ; Goto, H. ; Tahara, A. ; Ito, T.
Author_Institution
Fujitsu Labs. Ltd., Atsugi, Japan
fYear
1990
fDate
9-12 Dec. 1990
Firstpage
309
Lastpage
312
Abstract
High-speed bipolar transistor technology using a photoepitaxially grown ultrathin base is presented. Using this technology, a 31 nm base width with BVceo of 3.0 V could be realised. The cutoff frequency of the epitaxially grown base transistor (EBT) drastically improved from 32 GHz to 43 GHz as the base width decreased from 66 nm to 31 nm because the base transit time was effectively reduced. However, the minimum ECL (emitter coupled logic) gate delay time of the EBT was observed in the case of a 66 nm base width to be 58 ps at 7.5 mW/gate because the ultrathin base increased the base resistance. There was trade-off between the cutoff frequency and the ECL gate delay time. The authors integrated the EBT into a 1/8-divider, and observed a maximum operating frequency of 11.7 GHz.<>
Keywords
MMIC; bipolar integrated circuits; bipolar transistors; emitter-coupled logic; frequency dividers; integrated logic circuits; semiconductor epitaxial layers; 11.7 GHz; 3 V; 31 nm; 43 GHz; 58 ps; 7.5 mW; ECL; Si; base resistance; base transit time; cutoff frequency; emitter coupled logic; epitaxially grown base transistor; frequency dividers; gate delay time; high speed bipolar transistor; operating frequency; photoepitaxially grown ultra-thin base; trade-off; ultrathin base; Bipolar transistors; Cutoff frequency; Delay effects; Logic gates;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1990. IEDM '90. Technical Digest., International
Conference_Location
San Francisco, CA, USA
ISSN
0163-1918
Type
conf
DOI
10.1109/IEDM.1990.237168
Filename
237168
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