Ways to cost effective packaging: waveguide tapers and passive self-alignment

Author

Hunziker, W.

Author_Institution

Micro- & Optoelectron. Lab., Fed. Inst. of Technol., Zurich, Switzerland

Volume

1

fYear

1998

fDate

1-4 Dec 1998

Firstpage

36

Abstract

The packaging costs of OEIC´s dominate largely the price of an optoelectronic module by 60 to 90%. This is mainly due to the high precision requirements needed for the optical connections between single mode fibers (SMF) and waveguide components, such as lasers, modulators, switches, couplers, WDM devices and photodetectors. To overcome cost barriers in OE module packaging, the optical connection process has to be optimised to reduce packaging time and the needed precision of the alignment and fixation process

Keywords

integrated circuit packaging; integrated optoelectronics; measurement errors; modules; optical communication equipment; optical fabrication; optical fibre couplers; OE module packaging; OEIC; WDM devices; alignment process; cost barriers; cost effective packaging; fixation process; high precision requirements; lasers; modulators; optical connection process; optical connections; optical waveguide tapers; optimised; optoelectronic module; packaging costs; packaging time reduction; passive self-alignment; photodetectors; precision; single mode fiber couplers; switches; Costs; Fiber lasers; Laser modes; Optical devices; Optical fiber couplers; Optical fiber devices; Optical modulation; Optical waveguide components; Optical waveguides; Packaging;

fLanguage

English

Publisher

ieee

Conference_Titel

Lasers and Electro-Optics Society Annual Meeting, 1998. LEOS '98. IEEE

Conference_Location

Orlando, FL

Print_ISBN

0-7803-4947-4

Type

conf

DOI

10.1109/LEOS.1998.737720

Filename

737720