• DocumentCode
    3318549
  • Title

    Design of logic gates for high temperature and harsh radiation environment made of 4H-SiC MESFET

  • Author

    Alexandru, M. ; Banu, V. ; Vellvehi, M. ; Godignon, P. ; Millan, J.

  • Author_Institution
    IMB-CNM, CSIC, Barcelona, Spain
  • Volume
    02
  • fYear
    2010
  • fDate
    11-13 Oct. 2010
  • Firstpage
    413
  • Lastpage
    416
  • Abstract
    Silicon carbide MESFETs are very attractive devices for high frequency applications, and communications. Progresses in the manufacturing of high quality SiC substrates open the possibility to new circuit applications. SiC unipolar transistors, such as JFETs and MESFETs have also a promising potential for digital integrated circuits operating at high temperature (HT) and/or in harsh environments. An increasing demand for HT compliant circuits comes from intelligent power management, automotive industry, and intelligent sensors for harsh environment, space and aerospace as well. The present work is a demonstration of logic gates design with normally-on 4H-SiC MESFET devices using HT Spice models extracted from experimental measurements. A complete library of functional HT logic gates allows the implementation of complex logic embedded in power management circuitry.
  • Keywords
    SPICE; Schottky gate field effect transistors; logic design; logic gates; semiconductor device models; silicon compounds; wide band gap semiconductors; SiC; automotive industry; digital integrated circuits; harsh radiation environment; high-temperature SPICE models; high-temperature compliant circuits; intelligent power management; intelligent sensors; logic gate design; normally-on 4H-SiC MESFET devices; power management circuitry; unipolar transistors; Integrated circuit modeling; Logic gates; MESFETs; Resistors; Silicon carbide; Temperature; Temperature measurement; 4H-SiC; SiC MESFETs; SiC integrated circuits; high temperature electronics;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Conference (CAS), 2010 International
  • Conference_Location
    Sinaia
  • ISSN
    1545-827X
  • Print_ISBN
    978-1-4244-5783-0
  • Type

    conf

  • DOI
    10.1109/SMICND.2010.5650597
  • Filename
    5650597