DocumentCode :
3318991
Title :
Lateral distribution of interface states in PMOSFETs
Author :
Dimauro, J.L. ; Henning, A.K.
Author_Institution :
Thayer Sch. of Eng., Dartmouth Coll., Hanover, NH, USA
fYear :
1990
fDate :
9-12 Dec. 1990
Firstpage :
81
Lastpage :
84
Abstract :
Precise measurements of the lateral distribution of interface states in PMOSFETs, before and after drain-avalanche-hot-carrier (DAHC) stress, are reported. The results are analyzed in the context of simultaneous gate current and substrate current measurements, and 2-D numerical simulations. Comparison of the results to similar NMOSFET measurements demonstrates that electron injection across the Si-SiO/sub 2/ interface during DAHC stress creates amphoteric interface states along the drain-region interface and negative trapped oxide charge along the channel-region interface.<>
Keywords :
hot carriers; insulated gate field effect transistors; interface electron states; semiconductor-insulator boundaries; silicon; silicon compounds; DAHC stress; PMOSFETs; Si-SiO/sub 2/; amphoteric interface states; channel-region interface; drain-avalanche-hot-carrier; drain-region interface; interface states; lateral distribution; negative trapped oxide charge; simultaneous gate current; substrate current measurements; Charge measurement; Current measurement; Drain avalanche hot carrier injection; Electron traps; Interface states; MOSFET circuits; Numerical simulation; Stress measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 1990. IEDM '90. Technical Digest., International
Conference_Location :
San Francisco, CA, USA
ISSN :
0163-1918
Type :
conf
DOI :
10.1109/IEDM.1990.237221
Filename :
237221
Link To Document :
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