Air-interfacing microwave passive RFID tag in bulk CMOS

Author

Choi, Yeung Bun ; Yeoh, Wooi Gan

Author_Institution

Inst. of Microelectron., Singapore

fYear

2005

fDate

30 Nov.-2 Dec. 2005

Firstpage

65

Lastpage

69

Abstract

Overcoming the price hurdle that hampers mass-scale RFID adoption, this paper examines the architectural trade-offs as well as design issues involved in the development of a passive RFID tag IC targeted for low cost high volume deployment. Peculiar air-interfacing problems related to power rectification, data demodulation and backscattering modulation are addressed through the discussion of a design example whereby a 2.45-GHz RFID tag IC has been implemented in standard CMOS process.

Keywords

CMOS integrated circuits; UHF integrated circuits; backscatter; microwave integrated circuits; modulation; radiofrequency identification; 2.45 GHz; air-interfacing microwave passive RFID tag; backscattering modulation; bulk CMOS; data demodulation; high volume deployment; power rectification; standard CMOS process; Backscatter; CMOS technology; Costs; Passive RFID tags; RFID tags; Radiofrequency identification; Rectifiers; Silicon; Technical Activities Guide -TAG; Threshold voltage; ASK; CMOS; OOK; RFID; air interface; backscattering; passive; rectifier; threshold voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Radio-Frequency Integration Technology: Integrated Circuits for Wideband Communication and Wireless Sensor Networks, 2005. Proceedings. 2005 IEEE International Workshop on

Print_ISBN

0-7803-9372-4

Type

conf

DOI

10.1109/RFIT.2005.1598875

Filename

1598875