Title :
Characteristics of microdischarge devices in silicon
Author :
Frame, J.W. ; John, P.C. ; Bozeman, B. ; Wheeler, D.J. ; Eden, J.G. ; DeTemple, T.A.
Author_Institution :
Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
Abstract :
Summary form only given. We focus on a simpler discharge geometry that is more amenable to mass production. These devices consist of a Si cathode, a pyrex dielectric layer, and a Ni anode and differ from those previously reported in that the cathode is a plane rather than a cylinder. The devices are fabricated by drilling a hole in the pyrex using ultrasonic milling, anodically bonding the pyrex onto a silicon substrate, and then depositing the nickel anode
Keywords :
anodes; cathodes; discharge lamps; discharges (electric); micro-optics; optical fabrication; silicon; ultrasonic machining; 0.4 to 12 mum; 400 mum; Ni; Ni anode; Si; Si cathode; Si microdischarge devices; anodically bonding; cathode; cylinder; discharge geometry; drilling; hole; mass production; nickel anode; pyrex; pyrex dielectric layer; silicon substrate; ultrasonic milling; Anodes; Cathodes; Dielectric devices; Dielectric substrates; Drilling; Geometry; Mass production; Milling; Nickel; Silicon;
Conference_Titel :
Lasers and Electro-Optics Society Annual Meeting, 1998. LEOS '98. IEEE
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-4947-4
DOI :
10.1109/LEOS.1998.737825
