MEMS IC concept for advanced RF and millimeterwave communications

Author

Grenier, K. ; Dubuc, D. ; Do, N. ; Busquère, J.P. ; Coccetti, F. ; Coustou, A. ; Dragomirescu, D. ; Plana, R.

Author_Institution

LAAS-CNRS, Toulouse, France

fYear

2005

fDate

30 Nov.-2 Dec. 2005

Firstpage

135

Lastpage

138

Abstract

This paper aims to give an overview of the new architecture that will be embedded with the next generation of RF and millimeterwave modules that will have to feature new functionalities as flexibility and reconfigurability to match with all the standard that are or that will emerge, adaptability, testability to optimize the performances "on demand" in order to improve the autonomy, the reliability. The last issue deals with the miniaturisation that will be necessary to have a higher compactness for the modules and a reduced weight that is crucial for embedded applications.

Keywords

integrated circuits; micromechanical devices; radiocommunication; MEMS IC; RF communications; embedded applications; millimeterwave communications; miniaturisation; Acoustic materials; CMOS technology; Capacitive sensors; Integrated circuit technology; Micromechanical devices; Millimeter wave technology; Polymers; Radio frequency; Radiofrequency integrated circuits; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Radio-Frequency Integration Technology: Integrated Circuits for Wideband Communication and Wireless Sensor Networks, 2005. Proceedings. 2005 IEEE International Workshop on

Print_ISBN

0-7803-9372-4

Type

conf

DOI

10.1109/RFIT.2005.1598893

Filename

1598893