• DocumentCode
    3319432
  • Title

    New estimation method of short circuit inductance of coplanar probe for on-wafer scattering parameter measurement

  • Author

    Huang Hui ; Liu Xinmeng ; Lv Xin

  • Author_Institution
    Sch. of Inf. & Electron., Beijing Inst. of Technol., Beijing, China
  • Volume
    1
  • fYear
    2013
  • fDate
    16-19 Aug. 2013
  • Firstpage
    9
  • Lastpage
    12
  • Abstract
    The short impedance standard is the easiest fabricated in Open-Short-Load (OSL) calibration method for on-wafer scattering parameter (S-parameter) measurement. The fabrication and the definition of the other two impedance standard are more questionable. A new extraction method is presented to determine short inductance of coplanar waveguide (CPW) probe. Based on this consideration, other open capacitance and load inductance in OSL calibration method are compensated. The method needs only imperfective OSL impedance calibration kits and another standard offset short. It may improve on-wafer S-parameter accuracy of OSL calibration, which is the same as Thru-Reflect-Line (TRL) calibration. The experimental verification of the new estimation algorithm is given by using the designed and fabricated OSL calibration kit and standard offset short on Al2O3 substrate up to 50 GHz.
  • Keywords
    S-parameters; calibration; capacitance; coplanar waveguides; inductance; parameter estimation; S-parameter; coplanar waveguide probe; extraction method; load inductance; on-wafer scattering parameter measurement; open capacitance; open-short-load calibration method; short circuit inductance; short impedance standard; thru-reflect-line calibration; Calibration; Coplanar waveguides; Impedance; Inductance; Probes; Reflection coefficient; Standards; OSL calibration; S-parameter; on-wafer measurement; short inductance; standard offset short;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Measurement & Instruments (ICEMI), 2013 IEEE 11th International Conference on
  • Conference_Location
    Harbin
  • Print_ISBN
    978-1-4799-0757-1
  • Type

    conf

  • DOI
    10.1109/ICEMI.2013.6743017
  • Filename
    6743017