Mechanical properties of microspring thin films fabricated by glancing angle deposition (GLAD)

Author

Seto, M.W. ; Robbie, K. ; Brett, M.J.

Author_Institution

Dept. of Electr. & Comput. Eng., Alberta Univ., Edmonton, Alta., Canada

Volume

3

fYear

1999

fDate

9-12 May 1999

Firstpage

1616

Abstract

Unique thin film microstructures have been fabricated with the Glancing Angle Deposition (GLAD) technique. These porous, thin films can be engineered with a variety of many different morphologies to sub-micron dimensions. Mechanical properties of helically structured thin films were studied with a nanoindentation technique, allowing properties such as the spring constant to be determined. Present work on the study of these "microspring-beds" is ongoing, and includes the determination of resonant frequencies and application to potential devices.

Keywords

indentation; micromechanical devices; porous materials; vapour deposited coatings; fabrication; glancing angle deposition; helical structure; mechanical properties; microspring bed; microspring thin film; nanoindentation; physical vapour deposition; porous microstructure; resonant frequency; spring constant; Mechanical factors; Microstructure; Morphology; Motion control; Shape control; Springs; Sputtering; Substrates; Testing; Transistors;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical and Computer Engineering, 1999 IEEE Canadian Conference on

Conference_Location

Edmonton, Alberta, Canada

ISSN

0840-7789

Print_ISBN

0-7803-5579-2

Type

conf

DOI

10.1109/CCECE.1999.804958

Filename

804958