Trend of semiconductor packaging, high density and low cost

Author

Tsukada, Yutaka ; Kobayashi, Kaoru ; Nishimura, Hideo

Author_Institution

Component Technol. M&D, IBM Japan, Shiga, Japan

fYear

2002

fDate

4-6 Dec. 2002

Firstpage

1

Lastpage

6

Abstract

The form of semiconductor packaging is shifting from a wire bonded package to a flip chip package, using a buildup PCB as its substrate. Flip chip technology, used in main frame computers for a long time, is now spreading throughout many applications, with the large advantage of low cost achieved by "under-fill reinforced flip chip bonding" and "epoxy-base build-up PCB technology". The applications include telephones, high-tech consumer products, PC processors and ASICs, and there is an expected further movement to server applications. It is now nearing its original objective, the system-on-package.

Keywords

encapsulation; flip-chip devices; integrated circuit bonding; integrated circuit economics; integrated circuit packaging; ASIC; PC processors; build-up PCB substrate; epoxy-base build-up PCB technology; flip chip package; high density packaging; low cost packaging; semiconductor packaging; server applications; system-on-package; telephones; under-fill reinforced flip chip bonding; wire bonding; Application software; Bonding; Clocks; Costs; Flip chip; Frequency; Lungs; Semiconductor device packaging; Substrates; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on

Print_ISBN

0-7803-7682-X

Type

conf

DOI

10.1109/EMAP.2002.1188805

Filename

1188805