Title :
New polyimides containing aliphatic segments and thin films based on them
Author :
Popovici, D. ; Hulubei, C. ; Musteata, V.E. ; Bruma, M. ; Muller, A.
Author_Institution :
Petru Poni Inst. of Macromolecular Chem., Iasi, Romania
Abstract :
A series of polyimides (PI) based on two dianhydrides, namely 5-(2,5-dioxotetra-hydro-3-furanyl)-3-methyl-3-cyclohexene-1,2-dicarboxylicanhydride (DOCDA) and benzophenonetetracarboxylicdianhydride (BTDA), and an aliphatic diamine, namely 1,6 diaminohexane (DAH), have been obtained by solution polycondensation reaction, followed by thermal ring closure of the resulting polyamic acids. The chemical structures were identified by infrared and 1H-NMR spectroscopy and their thermal and electrical properties (dielectric constant and dielectric loss at different frequencies) were investigated. The polymers showed good thermal stability, with no significant weight loss up to 340°C, with 5% weight loss temperature in the range of 345-430°C and glass transition temperatures (Tgs) between 122-190°C. The resulting polyimides gave flexible films by thermal imdization of poly (amic acid) precursors. The AFM analysis revealed a smooth topography of their surfaces, with root-mean-square (Sq) roughness between 0.42-6.32 nm and average roughness (Sa) in the range of 0.33-2.39 nm. The dielectric constants of the PI films varied between 3.05 and 2.68 at 1 MHz frequency. The correlation between the polymers structure and their properties has been discussed.
Keywords :
dielectric losses; glass transition; infrared spectra; nuclear magnetic resonance; permittivity; polymer films; polymer structure; polymerisation; surface roughness; thermal stability; 1,6 diaminohexane; 1H-NMR spectroscopy; AFM; aliphatic segments; chemical structures; dianhydrides; dielectric constant; dielectric loss; electrical properties; frequency 1 MHz; glass transition temperatures; infrared spectroscopy; polyimides; root-mean-square roughness; smooth surface topography; solution polycondensation reaction; thermal imdization; thermal properties; thermal ring closure; thermal stability; thin films; weight loss temperature; Dielectric constant; Films; Plastics; Polyimides; Temperature measurement; Thermal stability;
Conference_Titel :
Semiconductor Conference (CAS), 2010 International
Conference_Location :
Sinaia
Print_ISBN :
978-1-4244-5783-0
DOI :
10.1109/SMICND.2010.5650689